MTFA500 resin film adhesive is designed to give enhanced toughness and great flexibility in component manufacture with cure temperatures between 80°C (176°F) and 120°C (248°F). It is a toughened epoxy resin system that can be supplied with or without fabric support to meet your cost and manufacturing requirements.
MTFA500 is a great all round resin film adhesive. It's properties are suitable for a multitude of applications.
Supplied with SHD's renowned service, including:
Short two-week lead times and low MOQs
Exceptional product quality
First class technical support
Excellent customer service
The same manufacturing equipment and processes across all sites
This material should be kept frozen at -18°C (0°F). It must be kept sealed in a polythene bag which must not be opened until fully thawed to room temperature. If the material is not fully used, then the material must be resealed in the polythene bag to prevent moisture absorption.
This material contains epoxy resin which can cause allergic reactions with skin contact and must avoid repeated and prolonged skin contact.
Please refer to the product Safety Data Sheet before using this material. The following precautions must be taken when using epoxy resin prepregs:
Overalls must be worn
Impervious gloves must be worn
Curing schedule is meant to be as a guide only and is subject to local conditions
To avoid exotherm, particular care must be taken with thick laminates
Ramp rates must not exceed 3.0°C (5.4°F)/min during initial cure and 0.3°C (0.5°F)/min during post cure
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